Smart Soldering
Uniform smart soldering increases the power and efficiency of the module, and improves the power load capacity.
Optimized Module Size
Large-format modules with M10 wafer size use dual-glass and frame packaging to ensure module strength.
Smart module packaging solutions are used to achieve high reliability, low-cost transportation and logistics.
Smart Module Packaging and Logistics
Optimized Electrical Parameters
The working current is about 13A, which is perfectly adapted to mainstream string inverters.
Bifacial Energy Yield
Additional power generation from the backside of bifacial modules increases the overall energy yield, which has been verified by customers and third-party testing organizations.
Junction box:
Split junction box, IP68, 3 diodes
Packaging:
31 pcs./pallet 155 pcs./20GP 620 pcs./40 GP
Electrical Performance Parameters (STC Test)
Module Type
LR5-72HBD-545M
LR5-72HBD-550M
LR5-72HBD-555M
Open-circuit voltage (Voc/V)
Short circuit current (Isc/A)
Peak power voltage (Vmp/V)
Peak power current (Imp/A)
STC: Standard test conditions
Electrical Performance Parameters (NOCT Test)
Module model
LR5-72HBD-545M
LR5-72HBD-550M
LR5-72HBD-555M
Open-circuit voltage (Voc/V)
Short circuit current (Isc/A)
Peak power voltage (Vmp/V)
Peak power current (Imp/A)
NOCT: Normal operating cell temperature
){kind=link}